Each component implemented two bits of a processor function; packages could be interconnected to build a processor with any desired word length. MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow! As of December 2020, the best mobile processor is Apple A14 Bionic which powers iPhone 12 Lineup. The Congo platform [5] was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market. Hi, I don"t find any information about the processor which have the last letter "Y". Both the processors are third most powerful chipset in the entire Qualcomm lineup. MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow! Find the best products from this list through our advanced filters and check detailed specifications. Used in desktop computing, Unlike the DX naming convention of the 486 chips, it had no math co-processor, 20 MHz, 3.1 MIPS, introduced January 25, 1989, 25 MHz, 3.9 MIPS, introduced January 25, 1989, 33 MHz, 5.1 MIPS, introduced October 26, 1992, Narrower buses enable low-cost 32-bit processing, Used in entry-level desktop and portable computing, No commercial software used protected mode or virtual storage for many years, Introduced January 16, 1989; discontinued June 15, 2001, Variant of 386SX intended for embedded systems, No "real mode", starts up directly in "protected mode", 25 MHz, 5.3 MIPS, introduced September 30, 1991, First chip specifically made for portable computers because of low power consumption of chip, Highly integrated, includes cache, bus, and memory controllers, Static core, i.e. [12] Qualcomm® FastConnect™ Subsystem . Samsung Acer Archos Mobiles Price List with 128GB Storage Price List in France Find out the Top Mobile Phones that available in France and sort these cell phones by price, brands, MobilesAB score and specifications. The document shows the complete 3rd Generation processor … 7nm is the next process shrink-down, offering improvements to silicon … Samsung introduced on Tuesday Exynos 2100, its first premium 5G-integrated mobile processor, built on the most advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node. Simple ranked list of mobile processors, maintained by PhoneCurry How is this ranking done? Mobile processors Westmere microarchitecture (1st generation) Arrandale" (MCP, 32 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel … The chipset will be based on … Integrated vision image processing unit identifies objects and environment of the scene and the advanced image processing unit uses the acquired data to fine-tune the settings such as exposure, white … DSP Technology: Qualcomm® Hexagon™ Tensor Accelerator. The Exynos 9611 processor is designed to offer artificial intelligence capabilities through a deep-learning technology. 32 KiB data per core 512 KiB per core 4 MiB Vega 3 192:12:4 3 CU : 1100 MHz 422.4 DDR4-2400 dual-channel: 12–25 W Ryzen 3 3200U: January 6, 2019 2.6 3.5 1200 MHz 460.8 Ryzen 3 2300U: January 8, 2018 4 (4) 2.0 3.4 Vega 6 384:24:8 6 CU : 1100 MHz 844.8 Ryzen 3 Pro 2300U: May 15, 2018 Ryzen 5 2500U Series: Core 2 Duo FSB: 1066 MHz L2 Cache: 3MB Manufacturing Tech: 45 nm Model #: SLGFD Return Policy: View Return Policy $9.95 – Samsung and ARM are working on a new flagship class mobile processor based on ARM A-76 processor with up to 3 GHz clock speed. It is using the 32 nm processor in it. China’s Huawei Technology Co. Ltd. is reportedly trying to give its smartphone ambitions a boost with plans to announce what would be the world’s first three-nanometer chipset.Details of the s Intel® Pentium® and Intel® Celeron® processors are economical product lines created for price-conscious consumers. The Tigris platform [6] introduced in September 2009 for the AMD Mainstream Notebook Platform consists of: MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V. The Snapdragon 768G Mobile Platform features our 5th generation Qualcomm® Artificial Intelligence (AI) Engine and Qualcomm® Hexagon™ Processor to power realistic gameplay while supporting unique and innovative use cases like real-time translation and ultra-smooth AI-based lens filters for social media apps at astonishing speeds. There are 18 Samsung 4G Snapdragon Processor … Image Signal Processor… Best AMD laptops are available here. Their OMAP34x series are made using the older 65 nm process, the OMAP36x use the newer 45 nm technology. This platform consists of: The Comal platform introduced on May 15, 2012 for the AMD Mainstream Notebook Platform consists of: 1 Config GPU are Unified shaders : Texture mapping units : Render output units, "Dublin" (Socket 754, CG, 130 nm, Desktop replacement), "Dublin" (Socket 754, CG, 130 nm, Low power), "Georgetown" (Socket 754, D0, 90 nm, Desktop replacement), "Sonora" (Socket 754, D0, 90 nm, Low power), "Albany" (Socket 754, E6, 90 nm, Desktop replacement), "Roma" (Socket 754, E6, 90 nm, Low power), "ClawHammer" (C0 & CG, 130 nm, Desktop replacement), "Odessa" (CG, 130 nm, Desktop replacement), "Oakville" (D0, 90 nm, 35 W TDP Low Power), "Keene" (Socket S1, F2, 90 nm, Low power), "Sherman" (Socket S1, G1 & G2, 65 nm, Low power), AMD RS880 series chipset + SB850 southbridge, List of AMD Accelerated Processing Unit microprocessors, "The AMD Sempron Processor Model 2100+ Enabling Fanless Designs for Embedded Systems", "AMD Processors for Notebooks: AMD Turion 64 X2 Mobile Technology, AMD Athlon 64 X2 Dual-Core, Mobile AMD Sempron Processor", "Mehr Leistung: Triple- und Quadcores für Notebooks - AMD Vision - neue Notebook-Plattformen Danube und Nile", "AMD Bakes New Interface Capabilities Into Richland APUs | News & Opinion", https://en.wikipedia.org/w/index.php?title=List_of_AMD_mobile_microprocessors&oldid=996676405, Advanced Micro Devices x86 microprocessors, Short description is different from Wikidata, Articles with unsourced statements from August 2013, Creative Commons Attribution-ShareAlike License, Turion 64 single-core 64-bit processor (codenamed, Mobile Sempron single-core 64-bit processor 65 nm (codenamed, Wireless IEEE 802.11 a/b/g/draft-N support, mini-PCIe Wi-Fi adapter, Mobile Sempron single-core 64-bit processor (codenamed, Split-power planes and linked power management support, Support for possible low voltage processors, Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter, Desktop and mobile Architecture for System Hardware (DASH) 1.0 support (, Single or Dual-core 64-bit processors codenamed, 15 W (single-core) or 18 W (dual-core) TDP, 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1", 25 W (single-core) or 35 W (dual-core) TDP, Single, Dual, Triple or Quad-core 64-bit processors codenamed, Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz), Unlike desktop models, mobile Phenom II-based models do not have L3 cache, Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz), Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz), Config GPU are Unified shaders : Texture mapping units : Render output units, Devastator graphics core with up to 384 SP, support for Single-channel DDR3 SDRAM and DDR3L SDRAM 1600 MHz memory, Turbo Dock Technology, C6 and CC6 low power states, This page was last edited on 28 December 2020, at 01:12. Process Technology: 7 nm. For the … Mobile processors consume less power than other types of CPUs, thus making them more energy-efficient. As semi-conductor industry has developed rapidly, many processors including Apple’s A11 processor, Qualcomm Snapdragon 835 processor, Samsung Exynos 8895 processor and Kirin 970 processor have been built on 10 nm manufacturing process. P6-based core, now including, System Bus clock rate 100 MHz, 133 MHz (B-models), 450, 500 MHz introduced February 26, 1999, 533, 600 MHz introduced (133 MHz bus clock rate) September 27, 1999, 256 KB (512 x 1024 B) Advanced Transfer L2 cache (Integrated), 242-pin Slot-1 SECC2 (Single Edge Contact cartridge 2) processor package, 370-pin, System Bus clock rate 100 MHz (E-models), 133 MHz (EB models), 650 MHz (100 MHz bus clock rate) introduced October 25, 1999, 700 MHz (100 MHz bus clock rate) introduced October 25, 1999, 750, 800 MHz (100 MHz bus clock rate) introduced December 20, 1999, 850 MHz (100 MHz bus clock rate) introduced March 20, 2000, 1000 MHz introduced March 8, 2000 (not widely available at time of release), 1133 MHz (first version recalled, later re-released), 400, 450, 500 MHz (Mobile) introduced October 25, 1999, 600, 650 MHz (Mobile) introduced January 18, 2000, 700 MHz (Mobile) introduced April 24, 2000, 750 MHz (Mobile) introduced June 19, 2000, 800, 850 MHz (Mobile) introduced September 25, 2000, 900, 1000 MHz (Mobile) introduced March 19, 2001, 256 KB or 512 KB Advanced Transfer L2 cache (integrated), 450 MHz (512 KB L2 cache) introduced October 6, 1998, 450 MHz (1 MB and 2 MB L2 cache) introduced January 5, 1999, 9.5 million transistors at 0.25 μm or 28 million at 0.18 μm, L2 cache is 256 KB, 1 MB, or 2 MB Advanced Transfer Cache (Integrated), Processor Package Style is Single Edge Contact Cartridge (S.E.C.C.2) or SC330, System Bus clock rate 133 MHz (256 KB L2 cache) or 100 MHz (1–2 MB L2 cache), Used in two-way servers and workstations (256 KB L2) or 4- and 8-way servers (1–2 MB L2), 550 MHz (0.25 μm process) introduced August 23, 1999, 667 MHz (0.18 μm process, 256 KB L2 cache) introduced October 25, 1999, 733 MHz (0.18 μm process, 256 KB L2 cache) introduced October 25, 1999, 800 MHz (0.18 μm process, 256 KB L2 cache) introduced January 12, 2000, 866 MHz (0.18 μm process, 256 KB L2 cache) introduced April 10, 2000, 933 MHz (0.18 μm process, 256 KB L2 cache), 1000 MHz (0.18 μm process, 256 KB L2 cache) introduced August 22, 2000, 700 MHz (0.18 μm process, 1–2 MB L2 cache) introduced May 22, 2000, Coppermine-128, 0.18 μm process technology, 66 MHz system bus clock rate, 100 MHz system bus clock rate from January 3, 2001, 633, 667, 700 MHz introduced June 26, 2000, 733, 766 MHz introduced November 13, 2000, 950, 1000, 1100 MHz introduced August 31, 2001, 600, 650 MHz (Mobile) introduced June 19, 2000, 700 MHz (Mobile) introduced September 25, 2000, 750 MHz (Mobile) introduced March 19, 2001, 500 MHz (ULV Mobile) introduced January 30, 2001, 1.00 GHz (Pentium M 723) (ultra low voltage, 5 W TDP), 1.10 GHz (Pentium M 733) (ultra low voltage, 5 W TDP), 1.20 GHz (Pentium M 753) (ultra low voltage, 5 W TDP), 1.30 GHz (Pentium M 718) (low voltage, 10 W TDP), 1.40 GHz (Pentium M 738) (low voltage, 10 W TDP), 1.50 GHz (Pentium M 758) (low voltage, 10 W TDP), 1.60 GHz (Pentium M 778) (low voltage, 10 W TDP), 350J – 1.30 GHz, with Execute Disable bit, 360J – 1.40 GHz, with Execute Disable bit, Intel Core Duo L2500 1.83 GHz (low voltage, 15W, Intel Core Duo L2400 1.66 GHz (low voltage, 15 W TDP), Intel Core Duo L2300 1.5 GHz (low voltage, 15 W TDP), Intel Core Duo U2500 1.2 GHz (ultra low voltage, 9 W TDP), 0.18 μm process technology (1.40 and 1.50 GHz), L2 cache was 256 KB Advanced Transfer Cache (Integrated), Processor Package Style was PGA423, PGA478, Used in desktops and entry-level workstations, 0.18 μm process technology (1.6 and 1.8 GHz), Core Voltage is 1.15 volts in Maximum Performance Mode; 1.05 volts in Battery Optimized Mode, Used in full-size and then light mobile PCs, Improved branch prediction and other microcodes tweaks, 533 MHz system bus. Modem Name Peak Download Speed Peak Upload Speed 5G mmWave specs 5G sub-6 GHz specs Downlink Carrier Aggregation Uplink Carrier Aggregation CPU Clock Speed CPU Cores Image Signal Processor Dual Camera, MFNR, ZSL, 30fps Single Camera, MFNR, ZSL, 30fps Single Camera Audio Technology GPU Name Qualcomm® Quick Charge™ Technology Support; … Tablets use mobile processors, which are very energy efficient. Rank Model Performance Level Geekbench 2 Geekbench 3 SC Geekbench 3 MC Geekbench 4 SC Geekbench 4 MC PassMark Performance Sunspider 1.0; 1: Apple A14 Bionic: Super High 2: Apple A13 Bionic: Super High 5415 13769 3: … Today, the most common Intel® processor names begin with Intel® Core™, Intel® Pentium®, and Intel® Celeron®. The following is a list of such product codes in numerical order: 10th generation Core, Comet Lake, Ice Lake, 8th generation Core/Coffee Lake/Kaby Lake Refresh/Whiskey Lake, 7th generation Core/Kaby Lake/Skylake (X-series Processors)/Apollo Lake, 32-bit processors: the non-x86 microprocessors, 32-bit processors: P6/Pentium M microarchitecture, 32-bit processors: NetBurst microarchitecture, 64-bit processors: Intel 64 – NetBurst microarchitecture, 64-bit processors: Intel 64 – Core microarchitecture, Celeron M (64-bit Core microarchitecture), 64-bit processors: Intel 64 – Nehalem microarchitecture, 64-bit processors: Intel 64 – Sandy Bridge / Ivy Bridge microarchitecture, Celeron (Sandy Bridge/Ivy Bridge Microarchitecture), Pentium (Sandy Bridge/Ivy Bridge Microarchitecture), 64-bit processors: Intel 64 – Haswell microarchitecture, 64-bit processors: Intel 64 – Broadwell microarchitecture, Core i7 (5th Generation, Including Core-X Series), 64-bit processors: Intel 64 – Skylake microarchitecture, 64-bit processors: Intel 64 – Kaby Lake microarchitecture, 64-bit processors: Intel 64 – Coffee Lake microarchitecture, 64-bit processors: Intel 64 – Cannon Lake microarchitecture, 64-bit processors: Intel 64 – Ice Lake microarchitecture, 64-bit processors: Intel 64 – Comet Lake microarchitecture, The 4004's original goal was to equal the clock rate of the, Intel IAPX 86,88 User's Manual, August 1981, Intel order number 210201-001, Sandy Bridge-HE-4, Sandy Bridge-H-2, Sandy Bridge-M-2, Bay Trail-T, Bay Trail-I, Bay Trail-D, Bay Trail-M, List of Intel Pentium Pro microprocessors, List of Intel Pentium III microprocessors, "Intel Unveils Full Intel® Core™ X-series Processor Family Specs", "Intel Microprocessor Quick Reference Guide – Product Family", Intel Processor Spec Finder for Celeron M, "Intel Pentium Processor G6950 (3M Cache, 2.80 GHz) with SPEC Code(s) SLBMS", "Intel Core X-series Processors in Intel's database on ark.intel.com", Intel Museum: History of the Microprocessor, Intel Processors and Chipsets by Platform Code Name, Advanced Programmable Interrupt Controller. Do you want to know the list of amd processor? MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64. First microprocessor (single-chip IC processor), They are ICs with CPU, RAM, ROM (or PROM or EPROM), I/O Ports, Timers & Interrupts. Promoted Watch UFC 250 Online – … Introduced in 2006, the Kite platform consists of: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V. AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007. Snapdragon 400 Chipset is designed to give better performance in mid-range phones, (Like price range from 12000 Rs to 16000 Rs), 400 chipset series is the first 64 bit mobile … This is usually aided by a greater sleep … Delayed in mastering the 10 and 7 nm standards, Intel began to lose its competitiveness. 69,900. It accesses both banks concurrently to read 16 bits of data in one clock cycle, Data bus width: 16 bits, address bus: 20 bits, First used in the Compaq Deskpro IBM PC-compatible computers. Process (nm… We have found 418 phones. The mobile processor, however, is most commonly associated with laptops, or notebooks. However, numerical codes, in the 805xx range, continued to be assigned to these processors for internal and part numbering uses. may run as slowly (and thus, power efficiently) as desired, down to full halt, Serial I/O units (sync and async) and parallel I/O, Significantly more successful than the 80376, Used aboard several orbiting satellites and microsatellites, 25 MHz, 20 MIPS (16.8 SPECint92, 7.40 SPECfp92), 33 MHz, 27 MIPS (22.4 SPECint92 on Micronics M4P 128 KB L2), introduced May 7, 1990, 50 MHz, 41 MIPS (33.4 SPECint92, 14.5 SPECfp92 on Compaq/50L 256 KB L2), introduced June 24, 1991, 1.2 million transistors at 1 μm; the 50 MHz was at 0.8 μm, 20 MHz, 16.5 MIPS, introduced September 16, 1991, 25 MHz, 20 MIPS (12 SPECint92), introduced September 16, 1991, 33 MHz, 27 MIPS (15.86 SPECint92), introduced September 21, 1992, 1.185 million transistors at 1 μm and 900,000 at 0.8 μm, Identical in design to 486DX but without a math coprocessor. Check the best deals and offers on mobile phones and tablets in your country. The chip is engineered with the Kryo 385 CPU with the clock speed of up to 2.8 GHz, and the Adreno 630 GPU with 30% improvement in graphics rendering. Samsung and ARM are working on a new flagship class mobile processor based on ARM A-76 processor with up to 3 GHz clock speed. Added protected-mode features to 8086 with essentially the same instruction set, Introduced January 1, 1981 as Intel's first, Two-chip General Data Processor (GDP), consists of 43201 and 43202, 43203 Interface Processor (IP) interfaces to I/O subsystem, 43204 Bus Interface Unit (BIU) simplifies building multiprocessor systems, Architecture and execution unit internal data base paths: 32 bits, Evolved from the capability processor developed for the BiiN joint venture with, Many variants identified by two-letter suffixes, Mid-life kicker in the i870 processor (primarily a speed bump, some refinement/extension of instruction set), Many variants, such as the PXA2xx applications processors, IOP3xx I/O processors and IXP2xxx and IXP4xx network processors, 20 MHz, 6 to 7 MIPS, introduced February 16, 1987, 25 MHz, 7.5 MIPS, introduced April 4, 1988, 33 MHz, 9.9 MIPS (9.4 SPECint92 on Compaq/i 16 KB L2), introduced April 10, 1989, Data bus width: 32 bits, address bus: 32 bits, Reworked and expanded memory protection support including, First used by Compaq in the Deskpro 386. Break the 5 GHz barrier with the new 10th Gen Intel® Core™ H-series mobile processor family and experience real-world performance that matters – incredible, high fps gaming and precious time-saving content creation, plus exceptional wireless connectivity with the latest integrated Wi-Fi technology (Intel® Wi-Fi 6 2 AX201 Gig+) on the market. (Latest Android). Concise technical data is given for each product. AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. The first mainstream 7 nm mobile processor intended for mass market use, the Apple A12 Bionic, was released at Apple's September 2018 event. Discover Samsung Exynos processor that leads the next-level mobile experiences with 5G and artificial intelligence. Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions. It is rumored that the Qualcomm Snapdragon 845 processor which will be launched at the end of this year will still be built … The Danube platform[7][10] introduced on May 12, 2010 for the AMD Mainstream Notebook Platform consists of: AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. Intel® Pentium® Processor on 45-nm Technology Specification Update Mobile Intel® 4 Series Express Chipset Family Datasheet 320122 Mobile Intel® 4 Series Express Chipset Family Specification Update 320123 15,990. 12,190. Wi-Fi/Bluetooth Subsystem: Qualcomm® FastConnect™ 6200. 2017-10-08 14:29:10. £ 126 € 141 $ 173 zł 639 R$ 919 MX$ 3,419 ₹ 12,618 руб … The phone comes with a 6.7 inch Full HD+ display and is powered by a 1.7GHz octa-core Qualcomm Snapdragon 730G processor. Although Huawei announced its own 7 nm processor before the Apple A12 Bionic, the Kirin 980 on August 31, 2018, the Apple A12 Bionic was released for public, mass market use to consumers before the Kirin 980. Machine intelligence is now vital for the next generation mobile devices. 2.45GHz Octa-Core Snapdragon 835 64-bit 10nm processor with Adreno 540 GPU 6GB LPDDR4x RAM with 64GB / 128GB (UFS) internal storage Android 7.1.1 (Nougat) with MIUI 8 ), Intel Celeron E1200 – 1.60 GHz (512 KB L2, 800 MHz FSB), Intel Celeron E3500 – 2.70 GHz (1 MB L2, 800 MHz FSB), Intel Celeron E3400 – 2.60 GHz (1 MB L2, 800 MHz FSB), Intel Celeron E3300 – 2.50 GHz (1 MB L2, 800 MHz FSB), Intel Celeron E3200 – 2.40 GHz (1 MB L2, 800 MHz FSB), Intel Celeron 450 – 2.20 GHz (512 KB L2, 800 MHz FSB), Intel Celeron 440 – 2.00 GHz (512 KB L2, 800 MHz FSB), Intel Celeron 430 – 1.80 GHz (512 KB L2, 800 MHz FSB), Intel Celeron 420 – 1.60 GHz (512 KB L2, 800 MHz FSB), Intel Celeron 220 – 1.20 GHz (512 KB L2, 533 MHz FSB), Intel Celeron 445 – 1.87 GHz (512 KB L2, 1066 MHz FSB), 650/655K – 3.2 GHz Hyper-Threading Turbo Boost, 660/661 – 3.33 GHz Hyper-Threading Turbo Boost, 670 – 3.46 GHz Hyper-Threading Turbo Boost, 680 – 3.60 GHz Hyper-Threading Turbo Boost, 975 (extreme edition) – 3.33 GHz/3.60 GHz Turbo Boost, 965 (extreme edition) – 3.20 GHz/3.46 GHz Turbo Boost, 880 – 3.06 GHz/3.73 GHz Turbo Boost (TDP 95W), 870/875K – 2.93 GHz/3.60 GHz Turbo Boost (TDP 95W), 870S – 2.67 GHz/3.60 GHz Turbo Boost (TDP 82W), 860 – 2.80 GHz/3.46 GHz Turbo Boost (TDP 95W), 860S – 2.53 GHz/3.46 GHz Turbo Boost (TDP 82W), 990X Extreme Edition – 3.46 GHz/3.73 GHz Turbo Boost, 980X Extreme Edition – 3.33 GHz/3.60 GHz Turbo Boost, 940XM Extreme Edition – 2.13 GHz/3.33 GHz Turbo Boost (8 MB L3, TDP 55W), 920XM Extreme Edition – 2.00 GHz/3.20 GHz Turbo Boost (8 MB L3, TDP 55W), 840QM – 1.86 GHz/3.20 GHz Turbo Boost (8 MB L3, TDP 45W), 820QM – 1.73 GHz/3.06 GHz Turbo Boost (8 MB L3, TDP 45W), 740QM – 1.73 GHz/2.93 GHz Turbo Boost (6 MB L3, TDP 45W), 720QM – 1.60 GHz/2.80 GHz Turbo Boost (6 MB L3, TDP 45W), W5590, X5570, X5560, X5550, E5540, E5530, L5530, E5520, L5520, L5518 – 4 cores, 8 MB L3 cache, HT, E5506, L5506, E5504 – 4 cores, 4 MB L3 cache, no HT, L5508, E5502, E5502 – 2 cores, 4 MB L3 cache, no HT, 2 physical cores/2 threads (500 series), 1 physical core/1 thread (model G440) or 1 physical core/2 threads (models G460 & G465), 2 MB L3 cache (500 series), 1 MB (model G440) or 1.5 MB (models G460 & G465), 500-series variants ending in 'T' have a peak TDP of 35 W, others – 65 W, All variants have peak GPU turbo frequencies of 1 GHz, Variants in the 400 series have GPUs running at a base frequency of 650 MHz, Variants in the 500 series ending in 'T' have GPUs running at a base frequency of 650 MHz; others at 850 MHz, 2-channel DDR3-1333 (800 series) or DDR3-1066 (600 series), Variants ending in 'T' have a peak TDP of 35 W, others 65 W, All variants have peak GPU turbo frequencies of 1.1 GHz, Variants ending in 'T' have GPUs running at a base frequency of 650 MHz; others at 850 MHz, All variants have GPU base frequencies of 650 MHz and peak GPU turbo frequencies of 1.05 GHz, Variants ending in 'T' have a peak TDP of 35 W, others – TDP of 55 W, Variants ending in '5' have Intel HD Graphics 3000 (12 execution units); others have Intel HD Graphics 2000 (6 execution units), Variants ending in '5' have Intel HD Graphics 4000; others have Intel HD Graphics 2500, 4 physical cores/4 threads (except for i5-2390T which has 2 physical cores/4 threads), 6 MB L3 cache (except for i5-2390T which has 3 MB), Variants ending in 'S' have a peak TDP of 65 W, others – 95 W except where noted, Variants ending in 'K' have unlocked multipliers; others cannot be overclocked, i5-2500T has a peak GPU turbo frequency of 1.25 GHz, others 1.1 GHz, Variants ending in '5' or 'K' have Intel HD Graphics 3000 (12 execution units), except i5-2550K which has no GPU; others have Intel HD Graphics 2000 (6 execution units), Variants ending in 'P' and the i5-2550K have no GPU, i5-2390T – 2.7 GHz/3.5 GHz Turbo Boost (35 W max TDP), i5-2500T – 2.3 GHz/3.3 GHz Turbo Boost (45 W max TDP), 4 physical cores/4 threads (except for i5-3470T which has 2 physical cores/4 threads), 6 MB L3 cache (except for i5-3470T which has 3 MB), Variants ending in 'S' have a peak TDP of 65 W, Variants ending in 'T' have a peak TDP of 35 or 45 W (see variants), others – 77 W except where noted, Variants ending in 'P' have no integrated GPU; others have Intel HD Graphics 2500 or Intel HD Graphics 4000 (i5-3475S and i5-3570K only), i5-3470T – 2.9 GHz/3.6 GHz max Turbo Boost (35 W TDP), i5-3570T – 2.3 GHz/3.3 GHz max Turbo Boost (45 W TDP), i5-3330S – 2.7 GHz/3.2 GHz max Turbo Boost, i5-3450S – 2.8 GHz/3.5 GHz max Turbo Boost, i5-3470S – 2.9 GHz/3.6 GHz max Turbo Boost, i5-3475S – 2.9 GHz/3.6 GHz max Turbo Boost, i5-3550S – 3.0 GHz/3.7 GHz max Turbo Boost, i5-3570S – 3.1 GHz/3.8 GHz max Turbo Boost, i5-3330 – 3.0 GHz/3.2 GHz max Turbo Boost, i5-3350P – 3.1 GHz/3.3 GHz max Turbo Boost (69 W TDP), i5-3450 – 3.1 GHz/3.5 GHz max Turbo Boost, i5-3470 – 3.2 GHz/3.6 GHz max Turbo Boost, i5-3550 – 3.3 GHz/3.7 GHz max Turbo Boost, i5-3570 – 3.4 GHz/3.8 GHz max Turbo Boost, i5-3570K – 3.4 GHz/3.8 GHz max Turbo Boost, Variants ending in 'S' have a peak TDP of 65 W, others – 95 W, All variants have base GPU frequencies of 850 MHz and peak GPU turbo frequencies of 1.35 GHz, Variants ending in 'K' have Intel HD Graphics 3000 (12 execution units); others have Intel HD Graphics 2000 (6 execution units), Up to 6 physical cores/12 threads depending on model number, Up to 20 MB L3 cache depending on model number, Variants (all marketed under "Intel Core X-series Processors"), i7-3820 – 3.6 GHz/3.8 GHz Turbo Boost, 4 cores, 10 MB L3 cache, i7-3930K – 3.2 GHz/3.8 GHz Turbo Boost, 6 cores, 12 MB L3 cache, i7-3960X – 3.3 GHz/3.9 GHz Turbo Boost, 6 cores, 15 MB L3 cache, i7-3970X – 3.5 GHz/4.0 GHz Turbo Boost, 6 cores, 15 MB L3 cache, Variants ending in 'S' have a peak TDP of 65 W, variants ending in 'T' have a peak TDP of 45 W, others – 77 W, i7-6800K – 3.40 GHz/3.60 GHz Turbo Boost/3.80 GHz Turbo Boost Max Technology 3.0 Frequency 15 MB L3 cache, i7-6850K – 3.60 GHz/3.80 GHz Turbo Boost/4.00 GHz Turbo Boost Max Technology 3.0 Frequency 15 MB L3 cache, i7-6900K – 3.20 GHz/3.70 GHz Turbo Boost/4.00 GHz Turbo Boost Max Technology 3.0 Frequency 20 MB L3 cache, i7-6950X – 3.00 GHz/3.50 GHz Turbo Boost/4.00 GHz Turbo Boost Max Technology 3.0 Frequency 25 MB L3 cache, single-CPU: Pentium D15nn, Xeon D-15nn, Xeon E3-12nn v4, Xeon E5-16nn v4, quad-CPU: Xeon E5-46nn v4, Xeon E7-48nn v4, Core i7-55nnU, Core i7-56nnU, Core i7-57nnHQ, Core i7-59nnHQ, 2-channel DDR3L-1333/1600, DDR4-1866/2133, Integrated GPU Intel HD Graphics 530 (only i3-6098P have HD Graphics 510), This page was last edited on 9 January 2021, at 17:57.